So, with an increase in density, the probability of failure also becomes high. The point is, there can be many such errors that can creep in during the design and fabrication processes. These are a few sources of errors or faults. So, the chances of two wires touching each other or a very thin wire breaking in between are high. Billions of transistors are involved in present-day VLSI chips. Design elements are coming closer and closer they are becoming smaller and thinner. Density Issue: Fabrication processes have become quite complicated with the advent of deep-submicron design technologies.Here’s a list of some possible issues that arise while manufacturing chips. Smaller die sizes increase the probability of some errors. However, new technologies come with new challenges. This has brightened the prospects for future industry growth. The introduction of new technologies, especially nanometre technologies with 14 nm or smaller geometry, has allowed the semiconductor industry to keep pace with increased performance-capacity demands from consumers. Today, semiconductors lie at the heart of ongoing advances across the electronics industry. Summary (TL DR) What is Design for Testability, and why we need it? Problems with manufacturing ICs.
#Fault diagnosis in sequential circuits pdf verification
What is the difference between Verification and Testing?.Improving the chip manufacturing process.What is Design for Testability, and why we need it?.
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